SOLIDWORKS Simulation Thermal Analysis Application For Semiconductor Industries

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By William

SOLIDWORKS Simulation Professional is a fully integrated solution with SOLIDWORKS that offers thermal study to tackle thermal related problem in product. Thermal analysis in SOLIDWORKS Simulation applies the principle of conduction, convection and radiation using CAD model of real-life product to simulate the thermal conditions of variable geometry and variable boundary condition.

In Semiconductor Industries, very often, there will be considerably amount of time spent on producing prototype to test for product durability and reliability. A typical scenario will be to analyse the surrounding environment of testing chamber where by heat source is required to maintain a constant testing temperature. We shall illustrate this in the following case study.

Case Study Description:

We will perform a steady-state thermal analysis on the microchip assembly to obtain the temperature at our point of interest during steady state. Our objective of the case study is to obtain the suitable and optimum boundary condition to maintain a constant testing temperature of 200oC in the testing chamber. In short, the design specification of the testing chamber using Optimization capability in SOLIDWORKS Simulation.

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The model consist of the five components include 3 connectors, ceramic microchip and a heat sink. The ceramic microchip will generate heat and heat is removed to the environment and through the heat sink. Connectors are built of insulator material which means there is no heat dissipated from the connectors. There will be a thin layer of Arctic silver 5 high conductance glue which will be represent with a thermal resistance value.

To summarize the above scenario, the ceramic microchip serve as a heat source and heat sink plays the roles to dissipate most of the heat to the ambient environment.

Applying Thermal Study

The specification and boundary condition for the study are listed below.

blog-sim-thermal-studies2Material

Component Material
Connector-1, Connector-2, Connector-3 Copper
Heat Sink-1 Copper
Microchip-2 Ceramic Porcelain

Thermal Resistance : 857 × 10-6  Km2/W (Value to obtain from material datasheet)

Thermal resistance is the representation of the thin layer of conductance glue which serves as adhesive between ceramic microchip and copper heat sink. We are assigning between the two touches face of ceramic microchip and copper heat sink.

blog-sim-thermal-studies3Heat power source : 25 W

Assigned to all the exposed faces of ceramic microchip to the environment.blog-sim-thermal-studies4Convection on heat sink : 250 W/(m2.K) (Value to obtain from material datasheet)

Bulk Ambient Temperature: 27oC (300 Kelvin)

Assigned to all the exposed faces of heat sink to the environment.

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Mesh and run.

Result and discussion on outcome of thermal study

Below show the temperature distribution on the microchip assembly.

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We narrow down our area of interest to the upper face of the microchip assembly.

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We notice that the maximum temperature for the top face is approximately 175 degree celcius.

Our objective of this thermal study is to maintain a constant temperature of 200oC during steady state. We understand that the convection coefficient value and the material value are constant. Hence the value that we can manipulate in this scenario is the heat power source and the ambient temperature.

In order to obtain this combination of heat power source and ambient temperature that can maintain a 200oC during steady state, we will utilize the optimization capability of SOLIDWORKS simulation.

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Variables value:

  1. Bulk Temperature : Range from 250K to 350K
  2. Heat Source : Range from 20 W to 30W
  3. Goals : Control with sensor to achieve 200oC

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After the Optimization study, SOLIDWORKS Simulation will provide you with multiple design scenarios and provide you with the most optimum design.

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From the optimization results, we notice that the closest value to our goal is with the design specification are as below cases:

  • Heat source : 20 W
  • Bulk Temperature : 350 K
  • Goal Temperature : 195.789 oC
  • Heat source : 30 W
  • Bulk Temperature : 300 K
  • Goal Temperature : 205.258oC

Hence we can conclude that with the range of value of Case 1 and 2 above, we can obtain a constant maximum of temperature 200oC. Of course, we have the option to continuously running the optimization study with further steps until we obtain the exact desired results.

With SOLIDWORKS 2016, we can definitely reduce the time needed to produce a working prototype and getting the right prototype right at the first time with a fully integrated solution in your CAD environment.

For More Information

For more SOLIDWORKS courses in Singapore, you may visit ATE website, email info-sg@ateworks.net or contact us at +65 6747 0502.

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